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First published on September 20, 2007, doi:10.1177/0731684407081366

Journal of Reinforced Plastics and Composites 2007;26:1665.

A more recent version of this article appeared on November 1, 2007

Article

Using Octa(aminpropyl)silsesquioxane as the Curing Agent for Epoxy Resin

Zengping Zhang1, Guozheng Liang1*, Xiaolei Wang1, and Jianqiang Xie2

1 Applied Chemistry Department, School of Science Northwestern Polytechnical University Xi’an, Shaanxi 710072, P.R. China
2 Department of Polymer Engineering Materials Engineering Institute Soochow University, Suzhou Jiangsu 215021, P.R. China

* To whom correspondence should be addressed.


  Abstract

Octa(aminpropyl)silsesquioxane (NH2CH2CH2CH2)8Si8O12 (POSS-NH2), containing eight amine groups on the vertexes, was first used as the curing agent for epoxy resin diglycidyl ether of bisphenol A(DGEBA) in order to improve the overall performance of epoxy resins, such as mechanical properties, thermal resistance and dielectric properties. The disappearance of epoxy groups on the FT-IR spectra at the end of the curing process indicated that epoxy groups reacted with POSS to form a three-dimensional crosslinking network, and the epoxy resin was completely cured. Properties of the cured DGEBA/POSS nanocomposite containing 30wt% of POSS-NH2 were studied. SEM images of the flexural fractures of epoxy/POSS system indicated that the inorganic-organic materials possessed excellent toughness. TGA analysis revealed that the cured network showed enhanced thermal stability with respect to the cured DGEBA/DDS system.

Key Words: polymer composites, Polyhedral Oligomeric Silsesquioxane, epoxy resin.


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