Journal of Reinforced Plastics and Composites

 

Advanced Search

Journal Navigation

Journal Home

Subscriptions

Archive

Contact Us

Table of Contents

SAGETRACK

Click here for more information

Sign In to gain access to subscriptions and/or personal tools.
This Article
Right arrow Full Text (PDF)
Right arrow All Versions of this Article:
0731684407081366v1
26/16/1665    most recent
Right arrow References
Right arrow Alert me when this article is cited
Right arrow Alert me if a correction is posted
Services
Right arrow Email this article to a friend
Right arrow Similar articles in this journal
Right arrow Similar articles in ISI Web of Science
Right arrow Alert me to new issues of the journal
Right arrow Add to Saved Citations
Right arrow Download to citation manager
Right arrowRequest Permissions
Right arrow Request Reprints
Right arrow Add to My Marked Citations
Citing Articles
Right arrow Citing Articles via Google Scholar
Google Scholar
Right arrow Articles by Zhang, Z.
Right arrow Articles by Liang, G.
Right arrow Search for Related Content
Social Bookmarking
Add to CiteULike   Add to Connotea   Add to Del.icio.us   Add to Digg   Add to Reddit   Add to Technorati  
What's this?
This version was published on November 1, 2007
Journal of Reinforced Plastics and Composites, Vol. 26, No. 16, 1665-1670 (2007)
DOI: 10.1177/0731684407081366
© 2007 SAGE Publications

Using Octa(aminpropyl)silsesquioxane as the Curing Agent for Epoxy Resin

Z. Zhang

Applied Chemistry Department, School of Science Northwestern Polytechnical University Xi'an, Shaanxi 710072, P.R. China

X. Wang

Applied Chemistry Department, School of Science Northwestern Polytechnical University Xi'an, Shaanxi 710072, P.R. China

J. Xie

Applied Chemistry Department, School of Science Northwestern Polytechnical University Xi'an, Shaanxi 710072, P.R. China

G. Liang

Department of Polymer Engineering Materials Engineering Institute Soochow University, Suzhou Jiangsu 215021, P.R. China, lgzheng{at}nwpu.edu.cn

Octa(aminpropyl)silsesquioxane (NH2CH2CH2CH 2)8Si8O12 (POSS-NH2), containing eight amine groups on the vertexes, was first used as the curing agent for epoxy resin diglycidyl ether of bisphenol A(DGEBA) in order to improve the overall performance of epoxy resins, such as mechanical properties, thermal resistance and dielectric properties. The disappearance of epoxy groups on the FT-IR spectra at the end of the curing process indicated that epoxy groups reacted with POSS to form a three-dimensional crosslinking network, and the epoxy resin was completely cured. Properties of the cured DGEBA/POSS nanocomposite containing 30wt% of POSS-NH2 were studied. SEM images of the flexural fractures of epoxy/POSS system indicated that the inorganic-organic materials possessed excellent toughness. TGA analysis revealed that the cured network showed enhanced thermal stability with respect to the cured DGEBA/DDS system.

Key Words: polymer composites • Polyhedral Oligomeric Silsesquioxane • epoxy resin.


Add to CiteULike CiteULike   Add to Connotea Connotea   Add to Del.icio.us Del.icio.us   Add to Digg Digg   Add to Reddit Reddit   Add to Technorati Technorati    What's this?